Archive

Posts Tagged ‘TSMC’

TSMC Preparing To Manufacturer A6X Chip As Apple Looks to Ditch Samsung

January 2nd, 2013 01:33 admin View Comments

Iphone

An anonymous reader writes with reports that TSMC is preparing to do a first test run of Apple’s A6X chipset currently manufactured by Samsung. The TSMC manufactured chips will feature a process shrink from 32nm to 28nm, and there’s a good chance Apple will grant them the contract for the next generation A7 chip. From SlashGear: “The test will kick off in Q1 2013, The China Times reports, with TSMC producing a new, 28nm version of the existing 32nm A6X that Samsung has been producing for the full-sized iPad 4th-gen; the smaller chip, which will likely be more power efficient as well, will debut in a new iPad 5th-gen and iPad mini 2.”

Source: TSMC Preparing To Manufacturer A6X Chip As Apple Looks to Ditch Samsung

TSMC and Global Foundries Plan Risky Process Jump As Intel Unveils 22nm SoC

December 10th, 2012 12:10 admin View Comments

Intel

MrSeb writes with news on the happenings with next generation fabrication processes. From the article: “… Intel’s 22nm SoC unveil is important for a host of reasons. As process nodes shrink and more components move on-die, the characteristics of each new node have become particularly important. 22nm isn’t a new node for Intel; it debuted the technology last year with Ivy Bridge, but SoCs are more complex than CPU designs and create their own set of challenges. Like its 22nm Ivy Bridge CPUs, the upcoming 22nm SoCs rely on Intel’s Tri-Gate implementation of FinFET technology. According to Intel engineer Mark Bohr, the 3D transistor structure is the principle reason why the company’s 22nm technology is as strong as it is. Earlier this year, we brought you news that Nvidia was deeply concerned about manufacturing economics and the relative strength of TSMC’s sub-28nm planar roadmap. Morris Chang, TSMC’s CEO, has since admitted that such concerns are valid, given that performance and power are only expected to increase by 20-25% as compared to 28nm. The challenge for both TSMC and GlobalFoundries is going to be how to match the performance of Intel’s 22nm technology with their own 28nm products. 20nm looks like it won’t be able to do so, which is why both companies are emphasizing their plans to move to 16nm/14nm ahead of schedule. There’s some variation on which node comes next; both GlobalFoundries and Intel are talking up 14nm; TSMC is implying a quick jump to 16nm. Will it work? Unknown. TSMC and GlobalFoundries both have excellent engineers, but FinFET is a difficult technology to deploy. Ramping it up more quickly than expected while simultaneously bringing up a new process may be more difficult than either company anticipates.”

Source: TSMC and Global Foundries Plan Risky Process Jump As Intel Unveils 22nm SoC

Report: Apple To Switch From Samsung to TSMC For ARM CPU Production

October 13th, 2012 10:41 admin View Comments

Hardware

another random user writes “Apple is planning to shift production of its ARM-based microprocessors from Samsung to the Taiwanese chip-baking giant TSMC as early as next year, according to a report by the China Economic News Service (CENS). The report cites CitiGroup Global Markets analyst J.T. Hsu as saying that TSMC will be Apple’s sole supplier of 20nm quad-core processors, with volume production to begin in the fourth quarter of 2013. He also noted that Apple began its 20nm chip-verfication process at TSMC in August of this year. Hsu told CENS that the future quad-core chips were intended for Apple’s ‘iPad, iTV and even Macbook,’ turning up the heat on two rumors that have been simmering for months: that Apple is planning a move into the television market, and that an ARM-based MacBook is in the works.”

Source: Report: Apple To Switch From Samsung to TSMC For ARM CPU Production

Mass Production of 450mm Wafers Bumped Back Again: 2018

September 5th, 2012 09:50 admin View Comments

Hardware

Taco Cowboy writes with news on the slipping schedules in the move toward both larger wafers and 3D integrated circuits in the semiconductor fab world. From the articles: “TSMC, … said it planned to start mass-producing next-generation 450mm wafers using advanced 10-nanometer technology in 2018. The advanced 10-nanometer chips could first be used in mobile devices and other consumer electronics, like game consoles, that demand high-performance and low power consumption. The plan was included in the latest technology roadmap unveiled by TSMC about one year after the chipmaker attributed its delay in making 450mm wafers, originally scheduled in 2015, to semiconductor equipment suppliers’ postponement in developing advanced equipment for manufacturing amid the industrial slump. Chipmakers can get 2.5 times more chips from a 450mm wafer than from a 300mm wafer … The industry’s gradual migration toward 3D ICs with through-silicon vias (TSV) is unlikely to happen until 2015 or 2016, according to sources at semiconductor companies. Volume production of 3D ICs was previously estimated to take place in 2014. Leading foundries and backend assembly and test service companies have all devoted much of their R&D efforts to TSV development, and are making progress. The major players are believed to be capable of supporting 3D ICs by 2014, but the emerging technology going into commercial production may not take place until around the 2015-16 timeframe.” Probably one of the most interesting presentations at HOPE9, “Indistinguishable From Magic: Manufacturing Modern Computer Chips,” covered modern semiconductor fabrication and why these things are cool. If you’re interested in more background (what do all of those TLAs mean?), check out the slides / audio (or attached video of the presentation from Youtube).

Source: Mass Production of 450mm Wafers Bumped Back Again: 2018

TSMC To Spend $10B Building Factory for 450mm Wafers

June 12th, 2012 06:30 admin View Comments

Hardware

An anonymous reader writes “With demand for processors growing and costs rising, using larger wafers for manufacturing is highly desirable, but a very expensive transition to make. TSMC just announced it has received approval from the Taiwan government to build a new factory for 450mm wafers, with the total cost of the project expected to be between $8-10 billion. The move to larger wafers isn’t without its risks, though. Building new facilities to handle production is the easy part. The industry as a whole has to overcome some major technical hurdles before 450mm becomes a viable replacement for the tried and tested 300mm process. TSMC’s chairman Morris Chang has stated the next five years will be filled with technical challenges, suggesting 450mm wafers may not be viable until at least 2017.”

Source: TSMC To Spend $10B Building Factory for 450mm Wafers

AMD Cancels 28nm APUs, Starts From Scratch At TSMC

November 22nd, 2011 11:20 admin View Comments

AMD

MrSeb writes “According to multiple independent sources, AMD has canned its 28nm Brazos-based Krishna and Wichita designs that were meant to replace Ontario and Zacate in the second half of 2012. The company will likely announce a new set of 28nm APUs at its Financial Analyst Day in February — and the new chips will be manufactured by TMSC, rather than its long-time partner GlobalFoundries. The implications and financial repercussions could be enormous. Moving 28nm APUs from GloFo to TSMC means scrapping the existing designs and laying out new parts using gate-last rather than gate-first manufacturing. AMD may try to mitigate the damage by doing a straightforward 28nm die shrink of existing Ontario/Zacate products, but that’s unlikely to fend off increasing competition from Intel and ARM in the mobile space.”

Source: AMD Cancels 28nm APUs, Starts From Scratch At TSMC

Apple’s A6 Details and Timeline Emerge

August 28th, 2011 08:11 admin View Comments

Portables

MojoKid writes “For a CPU that hasn’t seen the light of day, there’s a great deal of debate surrounding Apple’s A6 and the suggestion that it may not appear until later in 2012. The A6 is a complex bit of hardware. Rumors indicate that the chip is a quad-core Cortex-A9 CPU built on 28nm at TSMC and utilizing 3D fabrication technology. While the Cortex-A9 is a proven design, Apple’s A6 will be one of the first 28nm chips on the market. The chip will serve as a test case for TSMC’s introduction of both 28nm gate-last technology and 3D chip stacking. This is actually TSMC’s first effort with an Apple device. The A4 and A5 have both historically been manufactured by Samsung.”

Source: Apple’s A6 Details and Timeline Emerge

Apple’s A6 Details and Timeline Emerge

August 28th, 2011 08:11 admin View Comments

Portables

MojoKid writes “For a CPU that hasn’t seen the light of day, there’s a great deal of debate surrounding Apple’s A6 and the suggestion that it may not appear until later in 2012. The A6 is a complex bit of hardware. Rumors indicate that the chip is a quad-core Cortex-A9 CPU built on 28nm at TSMC and utilizing 3D fabrication technology. While the Cortex-A9 is a proven design, Apple’s A6 will be one of the first 28nm chips on the market. The chip will serve as a test case for TSMC’s introduction of both 28nm gate-last technology and 3D chip stacking. This is actually TSMC’s first effort with an Apple device. The A4 and A5 have both historically been manufactured by Samsung.”

Source: Apple’s A6 Details and Timeline Emerge

Apple Hopes To Drop Samsung As Chip Supplier

July 15th, 2011 07:34 admin View Comments

Patents

danomac writes “Apple is testing out new chip suppliers, trying to find a supplier other than Samsung. Apple is currently suing Android phone manufacturers, and Samsung is included in the lawsuit. ‘Apple faces several hurdles should it want to make a switch to TSMC, including patents and chip design issues as well as a push by Samsung to retain the business. … Analysts and other sources had previously said TSMC, the world’s largest contract chip maker, was set to become a supplier of a next-generation processor chip to Apple, likely starting next year. However the chip may not be called the A6, as some reports have indicated, the sources said. TSMC is an obvious candidate to win processor business from Apple as it has budgeted $7.8 billion this year to update technology and add capacity. It also has experience with the architecture of British chip designer ARM Holdings Plc, widely used by Apple to make power-efficient mobile chips.”

Source: Apple Hopes To Drop Samsung As Chip Supplier

YOYOYOOYOYOYO